Seminar Programme

As chips and servers evolve, data centres must rethink everything from rack design to cooling strategy. This panel brings chip/server manufacturers together with data centre engineering leaders to preview what’s coming next and translate it into practical facility implications: heat rejection, redundancy, serviceability, and monitoring. Expect a frank discussion on futureproofing and compatibility - what can be designed now, what must remain modular, and how to avoid stranded capex as silicon roadmaps accelerate.